THERMEON 4IN1 OSP DLC MCPCB-SinoDiamondLED Co., Ltd._

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THERMEON 4IN1 OSP DLC MCPCB

MOQ ：10000 piece

Lead Time ：30 Days

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Product details

Supply Ability

Supply Ability：10000000 piecesWarranty(Year)：1 Year

Packaging & Delivery

Packaging： piece

Product Specifications

Product Description

THERMEON replaces the epoxy laminate of conventional Al MCPCBs, used as the dielectric layer, with a proprietary DLC based dielectric stackthat provides unmatched thermal performance, a CTE (Coefficient of Thermal Expansion) well matched to LED substrate and epitaxial materials and contains no organics to degrade with time, temperature or exposure to humidity and solvents. It is ideal for high power applications such as LED-based lighting.

CoB Applications
For CoB applications, standard plating stacks comprising of Cu (1.0 oz.) + Ni (200 micro inch) , + Ag (10 micro inch) or Cu (1.0 oz.) + Ni (200 micro inch) , + Au (3 micro inch) is provided on all pads including Die Attach and Wirebond pads.

Construction
THERMEON HPI is constructed per Table 1 below. Standard interconnect thickness (Cu traces), core material and thickness are provided. For requirements other than those listed, please contact your local SinoDiamondLED Sales Representative for details.